Currently, Chinese non-automotive companies such as Huawei, Xiaomi, 360, and Skyworth have announced the manufacture of cars to compete for the new track of new energy vehicles.

Industry experts have analyzed that the reason why these technology giants are involved in the manufacture of automobiles is due to the popularity of the new energy vehicle market. According to relevant data, the sales volume of new energy vehicles in China is 732,000 units from January to April 2021, a cumulative increase of 249.2% year-on-year.

Second, in addition to the basic hardware equipment, the car also requires in-vehicle software to achieve in-vehicle functions. Therefore, co-manufacturing of automobiles is regarded as the best way for traditional vehicle companies and technology companies to achieve win-win cooperation, and the field of cooperation has begun to expand towards mobile intelligent terminals and computing platforms. In other words, the new energy vehicles in the future will be connected inductive products, and their related industrial chains will also develop and upgrade accordingly.

With the explosion of intelligent new energy vehicles, in-vehicle SSDs have also entered a new era. In-vehicle SSD not only needs to carry data for movie and video playback, but also needs to carry a series of large data such as various sensors, infotainment systems, navigation systems, human-computer interaction systems, and advanced driver assistance systems (ADAS). Therefore, the in-vehicle SSD capacity of intelligent electric vehicles is required to be large enough. According to Intel's forecast, a 2020-model connected intelligent electric vehicle can generate 4TB of data every 8 hours. It can be seen that the capacity of the in-vehicle SSD is crucial for intelligent electric vehicles.

In addition to requiring large capacity, on-board industrial SSDs will also face challenges such as vibration, voltage instability, unexpected power failure, high and low temperature, dust, and signal interference between devices in the whole machine. Therefore, the on-board solid-state drive of intelligent electric vehicles needs to have high-strength shock resistance, etc., to ensure the normal operation of intelligent vehicles.

As a leading enterprise in the storage field, Renice owns a number of self-developed on-board solid-state drives, which have the characteristics of large capacity, strong shock resistance, and stable read and write speed, which can meet the current needs of automobile intelligence and automation.

Customized Solution

Renice has CF Card, CFast Card, mSATA solid state drive and other on-board SSD solutions. The SSD capacity ranges from 8GB to 1TB, and the capacity can be customized according to actual needs.

Among them, Renice 1.8 inch micro-SATA SSD adopts SLC/MLC NAND flash technology and unique firmware architecture, which maximizes the bandwidth limitation of SATAIII and can achieve 75,000 data input and output operations per second (IOPS), which can meet the requirements of intelligent electric vehicles, automated data storage requirements.

Stable Performance

Renice vehicle SSD is injected with Renice's exclusive No Trim-Full Speed read and write technology, and is equipped with a SATA 6Gbps main control chip that supports No Trim function. Even without Trim support, the read and write performance remains close to the initial value.

In addition, Renice 1.8" micro-SATA SSD supports up to 540MB/s read and 440MB/s write performance, high-speed read and write speed, and can also meet the needs of future automobile intelligence and automation.

Conclusion

Will tech giants enter the automotive industry, making the auto industry more competitive? The answer is no. 

Because the industry requirements of intelligent electric vehicles are high, it is enough to accommodate companies in many fields. Therefore, while large companies are expanding the intelligent electric vehicle market, Renice will also launch more advanced on-board hard drives in due course to help the rapid development of the intelligent electric vehicle industry.